Scopus
Article
1
Microstructural and mechanical properties study of various lattice structures of SS316L-CNTs nano composites fabricated through additive manufacturing
Yadav B.N., Alfantazi A., Alazemi A.A., Mandal A., Lin P.C., Huang P.C., Yeh D.Y., Liu D.S.
Journal of Physics D: Applied Physics
2025, 58 (6)
Article
2
Manufacturing Reliability Assessment of Fine Ag Alloy Wire During Wire Loop Formation Process
Liu D., Chang T., Zhuang Z., Chao Y., Chung S., Huang P.
IEEE Access
2025, 13 , 14177-14185
Article
3
Investigation of process-induced periodic structure on n-type 4H-SiC with corresponding mechanical characteristics estimation
Liu D.S., Wen P.C., Zhuang Z.W., Chung C.L., Chen B.H., Chang P.I., Huang P.C.
Materials Today Communications
2024, 38
Conference Paper
4
Experimental and Numerical Investigation on Dynamic Response of Flip Chip Package Under Board Level Drop Test
Yen C.Y., Kao C.L., Lai W.H., Wang C.W., Liu H.C., Huang P.C., Zhuang Z.W., Liu D.S.
Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
2024 , 307-310
Article
5
Demonstration of curing degree estimation approach of EVA foam during injection moulding by integrating thermal–physical characteristics and FEA simulation
Tsang Y.W., Fu H.J., Zhuang Z.W., Chung C.L., Huang P.C., Chao Y.C., Liu D.S.
Polymer Bulletin
2024
Conference Paper
6
Temperature Dependence Mechanical Characteristics of Ag Alloy Wire and Corresponding Influence in Wire Bonding Procedure
Liu D.S., Wen P.C., Zhuang Z.W., Chao Y.C., Huang P.C.
2024 International Conference on Electronics Packaging, ICEP 2024
2024 , 157-158
Article
7
Injection moulding process parameter and strain rate dependence mechanical properties measurement and theoretical estimation of EVA polymer foam
Tsang Y.W., Fu H.J., Huang P.C., Yadav B.N., Liu D.S.
Journal of Mechanics
2024, 40 , 1-9
Article
8
Development and Demonstration on Process-Oriented Warpage Simulation Methodology of Fan-Out Panel-Level Package in Multilevel Integration
Lee C.C., Chang C.P., Huang P.C.
IEEE Transactions on Components, Packaging and Manufacturing Technology
2023, 13 (12) , 2016-2023
Article
9
Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach
Wang S.H., Hsu W., Liou Y.Y., Huang P.C., Lee C.C.
Micromachines
2023, 14 (8)
Article
10
Temperature-dependence mechanical characteristics investigation of Cu wire and corresponding high strain rate plasticity behaviors enabled by Johnson-Cook constitutive model
Liu D.S., Wen P.C., Zhuang Z.W., Chao Y.C., Huang P.C.
Journal of Mechanics
2023, 39 , 334-343