Scopus
Article
1
Microstructural and mechanical properties study of various lattice structures of SS316L-CNTs nano composites fabricated through additive manufacturing
Yadav B.N., Alfantazi A., Alazemi A.A., Mandal A., Lin P.C., Huang P.C., Yeh D.Y., Liu D.S.
Journal of Physics D: Applied Physics
2025, 58 (6)
Article
2
Manufacturing Reliability Assessment of Fine Ag Alloy Wire During Wire Loop Formation Process
Liu D., Chang T., Zhuang Z., Chao Y., Chung S., Huang P.
IEEE Access
2025, 13 , 14177-14185
Article
3
Carbon nanotubes used to enhance the wear properties of AlSi10Mg/CNTs nanocomposites prepared through additive manufacturing
Chang J.M., Yadav B.N., Mandal A., Tiwari J.K., Kam K.H., Liu D.S., Lin P.C.
Diamond and Related Materials
2024, 144
Article
4
Investigation of process-induced periodic structure on n-type 4H-SiC with corresponding mechanical characteristics estimation
Liu D.S., Wen P.C., Zhuang Z.W., Chung C.L., Chen B.H., Chang P.I., Huang P.C.
Materials Today Communications
2024, 38
Conference Paper
5
Experimental and Numerical Investigation on Dynamic Response of Flip Chip Package Under Board Level Drop Test
Yen C.Y., Kao C.L., Lai W.H., Wang C.W., Liu H.C., Huang P.C., Zhuang Z.W., Liu D.S.
Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
2024 , 307-310
Article
6
Demonstration of curing degree estimation approach of EVA foam during injection moulding by integrating thermal–physical characteristics and FEA simulation
Tsang Y.W., Fu H.J., Zhuang Z.W., Chung C.L., Huang P.C., Chao Y.C., Liu D.S.
Polymer Bulletin
2024
Conference Paper
7
Temperature Dependence Mechanical Characteristics of Ag Alloy Wire and Corresponding Influence in Wire Bonding Procedure
Liu D.S., Wen P.C., Zhuang Z.W., Chao Y.C., Huang P.C.
2024 International Conference on Electronics Packaging, ICEP 2024
2024 , 157-158
Article
8
Injection moulding process parameter and strain rate dependence mechanical properties measurement and theoretical estimation of EVA polymer foam
Tsang Y.W., Fu H.J., Huang P.C., Yadav B.N., Liu D.S.
Journal of Mechanics
2024, 40 , 1-9
Article
9
Temperature-dependence mechanical characteristics investigation of Cu wire and corresponding high strain rate plasticity behaviors enabled by Johnson-Cook constitutive model
Liu D.S., Wen P.C., Zhuang Z.W., Chao Y.C., Huang P.C.
Journal of Mechanics
2023, 39 , 334-343
Article
10
Development of a Novel Dynamic Modeling Approach for a Three-Axis Machine Tool in Mechatronic Integration
Liu D.S., Lu J.C., Tsai M.S., Wu C.T., Zhuang Z.W.
Machines
2022, 10 (11)
學術著作
1
“An experimental and numerical investigation into wafer probing parameters base on thin wafer breaking strength,”
D. S. Liu, Z. H. Chen, C.M. Chang, C.Y. Lee and H.C. Hsu
IEEE Transactions on Components, Packaging and Manufacturing Technology
2015 年
1 月
IEEE Transactions on Components, Packaging and Manufacturing Technology,Vol.5, No.1,pp.135-142
期刊論文
2
Effect of Thermoplastic Appliance Thickness on Initial Stress Distribution in Periodontal Ligament,”
De-Shin Liu and Yao-Te Chen
Advances in Mechanical Engineering
2015 年
4 月
Advances in Mechanical Engineering,Vol.7, No.4,pp.1-7
期刊論文
3
“Experimental and numerical investigations of the influence of chip-on-film packages: component operating temperature in natural convection,”
D. S. Liu, C. M. Chang, A. H. Liu, C. F. Huang, Y. C. Lee and C. Y. Tu
IEEE Transactions on Device and Materials Reliability
2014 年
6 月
IEEE Transactions on Device and Materials Reliability,Vol.14, No.2,pp.757-765
期刊論文
4
“Forged HITEMAL: Al-based MMCs strengthened with nanometric thick Al2O3 skeleton,”
Martin Balog, Peter Krizik, Martin Nosko, Zuzana Hajovska, Maria Victoria Castro Riglos, Walter rajner, De-Shin Liu and Frantisek Simancik
Materials Science and Engineering A
2014 年
9 月
Materials Science and Engineering A,Vol.613, No.,pp.82-90
期刊論文
5
“Optimization of Johnson-Cook Constitutive Model for Lead-free Solder Using Genetic Algorithm and Finite Element Simulations,”
D. S. Liu and C. L. Hsu
CMC-Computers materials & Continua
2014 年
10 月
CMC-Computers materials & Continua,Vol.40, No.3,pp.165-174
期刊論文
6
“Coupled PIEM/FEM algorithm based on Mindlin-Reissner plate theory for bending analysis of plates with through-thickness hole,”
De-Shin Liu, Chin-Yi Tu and Cho-Liang Chung
CMES-Computer Modeling in Engineering & Science
2013 年
4 月
CMES-Computer Modeling in Engineering & Science,Vol.92, No.6,pp.573-594
期刊論文
7
“Fast Numerical Algorithm for optimization mold shape of direct injection molding process,” , Vol. 28, Issue 6, pp 689-694, 2013
Yi-Ren Jeng, De-Shin Liu and Honz-Tzong Yau
Materials and Manufacturing Processes
2013 年
6 月
Materials and Manufacturing Processes,Vol.28, No.6,pp.689-694
期刊論文
8
“Develop-ment of Plate Infinite Element Method for Stress Analysis of Elastic Bodies with Singularities,”
De-Shin Liu, Kuo-Liang Cheng and Zhen-Wei Zhuang
Journal of Mechanics
2013 年
9 月
Journal of Mechanics,第29卷, 第3期,第481-492頁
期刊論文
9
“Relationship between medial plica and medial femoral condyle - a three-dimensional dynamic finite element model,”
De-Shin Liu, Zhen-Wei Zhuang and Shaw-Ruey Lyu
Clinical Biomechanics
2013 年
11 月
Clinical Biomechanics,Vol.28, No.9-11,pp.1000-1005
期刊論文
10
“Modeling of Moisture Diffusion in Permeable Particle-Reinforced Epoxy Resins Using Three-Dimensional Heterogeneous Hybrid Moisture Element Method,”
D. S. Liu, Z. H. Fong, I. H. Lin and Z. W. Zhuang
CMES-Computer Modeling in Engineering & Science
2013 年
7 月
CMES-Computer Modeling in Engineering & Science,Vol.93, No.6,pp.441-468
期刊論文